Quantitative metallography of β-Sn dendrites in Sn-3.8Ag-0.7Cu ball grid array solder balls via electron backscatter diffraction and polarized light microscopy
Document Type
Conference Proceeding
Publication Date
12-2004
Department
Department of Materials Science and Engineering
Abstract
Electron backscatter diffraction and polarized light microscopy have been used to quantify the number of crystallographically independent β-Sn dendrites present in near-eutectic, ball grid array Sn-Ag-Cu (SAC) solder balls as a function of cooling rate (0.35-3.0°C/s). Based on these data, it is estimated that a single 900-μm-diameter solder ball contains on average eight individual β-Sn dendrites, independent of cooling rate. Specific orientation relationships were also found to be prevalent between neighboring β-Sn dendrites. These results confirm and expand upon recent research, and further emphasize the probable anisotropic nature of SAC solder joints.
Publication Title
Journal of Electronic Materials
Recommended Citation
Lalonde, A.,
Emelander, D.,
Jeannette, J.,
Larson, C.,
Rietz, W.,
Swenson, D. J.,
&
Henderson, D.
(2004).
Quantitative metallography of β-Sn dendrites in Sn-3.8Ag-0.7Cu ball grid array solder balls via electron backscatter diffraction and polarized light microscopy.
Journal of Electronic Materials,
33(12), 1545-1549.
http://doi.org/10.1007/s11664-004-0096-8
Retrieved from: https://digitalcommons.mtu.edu/michigantech-p/5076