A photoelastic and FEM analysis of interfacial crack propagation

Authors

I. Miskioglu, Michigan Technological UniversityFollow
C. R. Villmann, Michigan Technological University
J. S. Pawloski, Michigan Technological University
D. M. Pariseau, Michigan Technological University

Document Type

Article

Publication Date

6-1991

Department

Department of Mechanical Engineering-Engineering Mechanics

Abstract

The linear elastic solution for the bimaterial interface crack is applied to determine the direction of crack propagation during surface-layer removal by scraping. The direction of the load which must be applied to the free end of the surface layer for continued interfacial crack propagation is determined using photoelasticity and finite elements, and results are found to be in good agreement.

Publisher's Statement

© 1991 Society for Experimental Mechanics, Inc. Publisher’s version of record: https://doi.org/10.1007/BF02327565

Publication Title

Experimental Mechanics

Recommended Citation

Miskioglu, I., Villmann, C., Pawloski, J., & Pariseau, D. (1991). A photoelastic and FEM analysis of interfacial crack propagation. Experimental Mechanics, 31(2), 135-139. http://doi.org/10.1007/BF02327565
Retrieved from: https://digitalcommons.mtu.edu/michigantech-p/4361