Date of Award
2026
Document Type
Open Access Master's Thesis
Degree Name
Master of Science in Electrical and Computer Engineering (MS)
Administrative Home Department
Department of Electrical and Computer Engineering
Advisor 1
Christopher T. Middlebrook
Committee Member 1
Paul L. Bergstrom
Committee Member 2
Shane W. Oberloier
Abstract
An advanced demonstrator Printed Circuit Board (PCB) has been designed and implemented providing a framework for advancing students’ knowledge in hands-on PCB design and manufacturing process through industry recognized test coupons, stack ups, and transmission lines. Students are guided through several key aspects of design and simulation relating to manufacturing and qualifications. Manufacturing allows students to refine process development and analyze performance data with respect to qualification tests specified by Global Electronics Association standards. Results are then used to build a stackup model, and complete a design activity for calculating expected test results for a series of controlled impedance electrical traces. The design exercise is organized to demonstrate the operational theory of time domain reflectometers (TDRs) and vector network analyzers (VNAs). A series of TDR and VNA tests are then performed to evaluate the performance of the PCB panel to gain experience operating high-speed and radio frequency (RF) test equipment.
Creative Commons License

This work is licensed under a Creative Commons Attribution-Share Alike 4.0 License.
Recommended Citation
Keppers, Benjamin S., "HIGH-PERFORMANCE CIRCUIT MANUFACTURING AND TESTING EXERCISES", Open Access Master's Thesis, Michigan Technological University, 2026.
https://digitalcommons.mtu.edu/etdr/2154
Included in
Electronic Devices and Semiconductor Manufacturing Commons, Engineering Education Commons