Date of Award

2020

Document Type

Open Access Master's Report

Degree Name

Master of Science in Mechanical Engineering (MS)

Administrative Home Department

Department of Mechanical Engineering-Engineering Mechanics

Advisor 1

Amitabh Narain

Committee Member 1

Sunil Mehendale

Committee Member 2

Kazuya Tajiri

Abstract

The report describes the science and technology backgrounds and uses for the technology breakthrough reported for enhanced flow-boiling based cooling of high-power density electronics (chips, memory etc.). A controlled but explosive growth in micro-scale nucleation rates during flow-boiling of HFE-7100 (electronics and environment friendly liquid from 3M, Inc) is enabled by the uses of inexpensive meshed-copper for micro-structuring of the boiling surface and a pair of Piezoelectric-transducers for active imposition of suitable acoustic vibrations. The pair of piezo transducers mounted just outside the mini-channel impose “in plane” acoustic vibrations of controllable amplitudes and frequencies, and they are used to induce phenomena which make flow-boiling highly efficient. Superposition of such active resonant acoustics towards beneficial actuation of the bubbles’ ebullition cycles, where mesh-tips' minuscule structural vibrations play key roles, are an important part of the enabling science and technology. Even preliminary results show, relative to currently popular water-based Direct Contact Liquid Cooling (DCLC) or Direct to Chip (D2C) liquid cooling approaches, heat transfer efficiency goes up by 700%, driving temperature difference goes down by 80-90%, maximum allowed average heat-flux goes up from about 35 W/cm2 to more than 70 – 100 W/cm2, and boiling surface temperatures can be adjusted in the range of 50 - 650C (as needed) relative to the maximum allowed chip junction temperature of 80 - 850C (or less).

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