Title
Investigation of adhesion and interface bond strength for pavements underlying chip-seal: Effect of asphalt-aggregate combinations and freeze-thaw cycles on chip-seal
Document Type
Article
Publication Date
1-25-2019
Abstract
The objective of this study is to investigate the effect of the asphalt-aggregate combination and freeze-thaw cycle on the durability of chip-seal. The Vialit test was applied to investigate the adhesion of asphalt-emulsion and aggregate at low-temperatures. Tests were performed at −10, −22, and −26 °C for asphalt-emulsion based chip-seal. In addition, the Michigan Tech’s Interface Bond Test (IBT) was also employed to assess the interface bond strength between the chip-seal layer and asphalt pavement under varying temperatures and under a number of freeze-thaw cycles. Both tests indicated that the asphalt-aggregate combinations and freeze-thaw cycle had significant impact on the durability of chip-seal. The combination between asphalt-emulsion and aggregate cannot be ignored in chip-seal application. Such results suggest that the premature failure of the chip-seal is in part due to the raw materials used and the multiple freeze-thaw cycles suffered. Therefore, it is essential to select the appropriate combination of aggregate and asphalt-emulsion when considering the use of chip-seal, especially in cold weather areas.
Publication Title
Construction and Building Materials
Recommended Citation
You, L.,
You, Z.,
Dai, Q.,
Xie, X.,
Washko, S.,
&
Gao, J.
(2019).
Investigation of adhesion and interface bond strength for pavements underlying chip-seal: Effect of asphalt-aggregate combinations and freeze-thaw cycles on chip-seal.
Construction and Building Materials,
23(10), 322-330.
http://doi.org/10.1016/j.conbuildmat.2019.01.058
Retrieved from: https://digitalcommons.mtu.edu/cee-fp/67
Publisher's Statement
Copyright 2019 Elsevier Ltd. All rights reserved. Publisher's version of record: https://doi.org/10.1016/j.conbuildmat.2019.01.058