Affinity-driven modeling and scheduling for makespan optimization in heterogeneous multiprocessor systems
Document Type
Article
Publication Date
7-2019
Department
Department of Electrical and Computer Engineering
Abstract
With the advent of heterogeneous multiprocessor architectures, efficient scheduling for high performance has been of significant importance. However, joint considerations of reliability, temperature, and stochastic characteristics of precedence-constrained tasks for performance optimization make task scheduling particularly challenging. In this paper, we tackle this challenge by using an affinity (i.e., probability)-driven task allocation and scheduling approach that decouples schedule lengths and thermal profiles of processors. Specifically, we sep-arately model the affinity of a task for processors with respect to schedule lengths and the affinity of a task for processors with regard to chip thermal profiles considering task reliability and stochastic characteristics of task execution time and intertask communication time. Subsequently, we combine the two types of affinities, and design a scheduling heuristic that assigns a task to the processor with the highest joint affinity. Extensive simu-lations based on randomly generated stochastic and real-world applications are performed to validate the effectiveness of the proposed approach. Experiment results show that the proposed scheme can reduce the system makespan by up to 30.1% without violating the temperature and reliability constraints compared to benchmarking methods.
Publication Title
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Recommended Citation
Cao, K.,
Zhou, J.,
Cong, P.,
Li, L.,
Wei, T.,
Chen, M.,
Hu, S.,
&
Hu, X. S.
(2019).
Affinity-driven modeling and scheduling for makespan optimization in heterogeneous multiprocessor systems.
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems,
38(7), 1189-1202.
http://doi.org/10.1109/TCAD.2018.2846650
Retrieved from: https://digitalcommons.mtu.edu/michigantech-p/572
Publisher's Statement
c 2018 IEEE. Publisher’s version of record: https://doi.org/10.1109/TCAD.2018.2846650