Performance analysis of metallic carbon nanotubes as nanotechnology circuit interconnects

Authors

Vidur Parkash, Michigan Technological University
Ashok K. Goel, Michigan Technological UniversityFollow

Document Type

Article

Publication Date

11-2011

Department

Department of Electrical and Computer Engineering

Abstract

Carbon nanotubes (CNTs) have emerged as a potential nanoelectronic material that can replace traditional copper as the material for very large scale integrated circuits (VLSI) interconnects.In this article, we have quantified the performance expected out of CNTs-based interconnect systems based on realistic characterization of their Tomonaga Luttinger theory-based transmission line model. We have presented performance estimates for bus systems consisted of single-walled nanotubes and crystalline bundles of CNTs. Results indicate that the bundles offer at leasta 10 times performance advantage over isolated nanotubes. However, this is at the expense of larger signal damping associated with them.

Publisher's Statement

Copyright © 2011 Wiley Periodicals, Inc. Publisher’s version of record: https://doi.org/10.1002/mop.26314

Publication Title

Microwave and Optical Technology Letters

Recommended Citation

Parkash, V., & Goel, A. (2011). Performance analysis of metallic carbon nanotubes as nanotechnology circuit interconnects. Microwave and Optical Technology Letters, 53(11), 2505-2508. http://doi.org/10.1002/mop.26314
Retrieved from: https://digitalcommons.mtu.edu/michigantech-p/3779