Document Type
Article
Publication Date
6-26-2020
Department
Department of Biomedical Engineering; Department of Electrical and Computer Engineering; Department of Materials Science and Engineering
Abstract
This study describes the development of an automated bag valve mask (BVM) compression system, which, during acute shortages and supply chain disruptions can serve as a temporary emergency ventilator. The resuscitation system is based on the Arduino controller with a real-time operating system installed on a largely RepRap 3-D printable parametric component-based structure. The cost of the system is under $170, which makes it affordable for replication by makers around the world. The device provides a controlled breathing mode with tidal volumes from 100 to 800 milliliters, breathing rates from 5 to 40 breaths/minute, and inspiratory-to-expiratory ratio from 1:1 to 1:4. The system is designed for reliability and scalability of measurement circuits through the use of the serial peripheral interface and has the ability to connect additional hardware due to the object-oriented algorithmic approach. Experimental results demonstrate repeatability and accuracy exceeding human capabilities in BVM-based manual ventilation. Future work is necessary to further develop and test the system to make it acceptable for deployment outside of emergencies in clinical environments, however, the nature of the design is such that desired features are relatively easy to add with the test using protocols and parametric design files provided.
Publication Title
Preprints
Recommended Citation
Petsiuk, A.,
Tanikella, N.,
Dertinger, S. C.,
Pringle, A.,
Oberloier, S.,
&
Pearce, J. M.
(2020).
RepRapable automated open source bag valve mask-based ventilator.
Preprints.
http://doi.org/10.20944/preprints202006.0318.v1
Retrieved from: https://digitalcommons.mtu.edu/michigantech-p/2110
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 International License.
Version
Publisher's PDF
Included in
Biomedical Engineering and Bioengineering Commons, Electrical and Computer Engineering Commons, Materials Science and Engineering Commons
Publisher's Statement
© 2020 by the author(s). Distributed under a Creative Commons CC BY license. Publisher’s version of record: https://doi.org/10.20944/preprints202006.0318.v1