Fast interconnect synthesis with layer assignment
Document Type
Conference Proceeding
Publication Date
5-16-2008
Abstract
As technology scaling advances beyond 65 nanometer node, more devices can fit onto a chip, which implies continued growth of design size. The increased wire delay dominance due to finer wire widths makes design closure an increasingly challenging problem. Interconnect synthesis techniques, such as buffer insertion/sizing and wire sizing, have proven to be the critical part of a successful timing closure optimization tool. Layer assignment, which was traditionally treated as same as wire sizing, is more effective and friendly in the design flow than wire sizing in the advanced technologies. Techniques for simultaneous layer assignment and buffer insertion with resource control are increasingly important for the quality of results of interconnect synthesis. This paper outlines the importance of layer assignment over wire sizing, and presents efficient techniques to perform concurrent buffer insertion and layer assignment to fix the electrical and timing problems, while maintaining speed and efficient use of resources. Copyright 2008 ACM.
Publication Title
Proceedings of the International Symposium on Physical Design
Recommended Citation
Li, Z.,
Alpert, C.,
Hu, S.,
Muhmud, T.,
Quay, S.,
&
Villarrubia, P.
(2008).
Fast interconnect synthesis with layer assignment.
Proceedings of the International Symposium on Physical Design, 71-77.
http://doi.org/10.1145/1353629.1353648
Retrieved from: https://digitalcommons.mtu.edu/michigantech-p/12487