Comparison of modular measurement methods based on consistency analysis and sensitivity analysis
Document Type
Conference Proceeding
Publication Date
1-1-2003
Abstract
Most modularity measures center on quantifying dependencies with components external to modules. Some modularity measures include an accounting-of component similarity. What is measured as dependencies and similarities varies by measure and by context. Additionally, there is some subjectivity in the measures. Noticeably, the measures lack rigorous verification and validation. There is also a lack of quantitative comparison among the various measures. This research highlights the consistencies among the measures of modular product design and attempts to select a single measure for use in future applications. A list of eight alternative modularity measures was developed from available literature. The goal was to compare these measures to find the most representative measure with high similarity to the mainstream of all measures but also with a high sensitivity to changes in modularity. Our hypothesis is that, since many measures look somewhat similar, we are looking for one measure that is in agreement with most measures and therefore performs reliably; it should also be significantly more sensitive. Similarity was defined via consistency analysis - similar measurements rank the different product modularities in the same sequence. Sensitivity was compared by slightly changing the product architecture of example products and then quantifying which measures are more sensitive to these changes. Analysis was based on 11 products: a Fisher-price Chatter Radio, a Proctor Silex automatic drip coffeemaker, a Johnson fishing reel with pre-spooled line, a Sunbeam home hair trimmer, a Farberware ice cream scoop, a Regent halogen clamp lamp, a Bell classic portable bicycle pump, a Pur faucet mount water filter, an ANCO premium wiper blade, a Kodak single-use camera, and an Adhesive Tech mini glue gun.
Publication Title
Proceedings of the ASME Design Engineering Technical Conference
Recommended Citation
Guo, F.,
&
Gershenson, J.
(2003).
Comparison of modular measurement methods based on consistency analysis and sensitivity analysis.
Proceedings of the ASME Design Engineering Technical Conference,
3, 393-401.
http://doi.org/10.1115/detc2003/dtm-48634
Retrieved from: https://digitalcommons.mtu.edu/michigantech-p/11748