An experimental investigation of the effects of cycling frequency and temperature on the fatigue life of 60 tin/40 lead solder
Document Type
Article
Publication Date
1-1-1996
Abstract
The effects of cycling frequency and temperature on the fatigue life of solder has been analyzed. Mechanical fatigue life experiments were conducted under load control while varying the temperature and cycling frequency. Using the experimental data, a fatigue model was formulated based on the Basquin and the Coffin-Manson relations, introducing the effects of temperature and frequency. The model parameters were obtained by a statistical method incorporating multiple linear regression. Using the model, estimated values of cycles to failure at each of the testing temperatures and frequency were calculated. Using the estimated values, an evaluation of each of the models was conducted, resulting in strong correlations between the model’s estimation and the experimental data. © 1996 ASME.
Publication Title
Journal of Electronic Packaging, Transactions of the ASME
Recommended Citation
Leeee, G.,
Miskioglu, I.,
&
Nelson, D.
(1996).
An experimental investigation of the effects of cycling frequency and temperature on the fatigue life of 60 tin/40 lead solder.
Journal of Electronic Packaging, Transactions of the ASME,
118(4), 280-284.
http://doi.org/10.1115/1.2792164
Retrieved from: https://digitalcommons.mtu.edu/michigantech-p/11553