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Abstract

The present disclosure includes solid-state transducers, a system, and a method. In one embodiment, a solid-state transducer includes a housing, a first end portion, a second end portion, a plurality of electrical conductors, and a thin-film resistive material. The thin-film resistive material is disposed between and in electrical communication with a plurality of electrical conductors. The thin-film resistive material is configured to receive one or more electrical signals from the plurality of electrical conductors, and generate thermal oscillations to create pressure waves in a medium in response to receiving the one or more electrical signals.

Patent Number

10,943,577

Assignee

Michigan Technological University

Application Number

16/473,998

Date Filed

1-2-2018

Certificate of Correction

No

Issue Date

3-9-2021

Disciplines

Engineering Mechanics | Mechanical Engineering

Solid-state transducer, system, and method

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