A multiphase heat transfer model for spreading wall film coupled with solid wall temperature field

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Department of Mechanical Engineering-Engineering Mechanics


A simplified model for wall film impingement, spreading and evaporation is proposed in this work. The performance of the model was compared with experimental data. For the experimental data, a 2.8 mm diameter diesel drop at 423 K was impinged on a stainless steel wall. The solid surface and embedded temperature was recorded with time. The variation of film spread fraction, which is the ratio of the film spread diameter to the original drop diameter was also recorded with time. The present model deals with solid, liquid and gas phase physics of the wall film. An analytical expression developed previously for the heat flux from the ambient gas into the liquid gas interface, is used to represent the temperature distribution within the film. The correlation for heat transfer coefficient at the solid–liquid interface was developed and the solid temperature distribution is solved using the semi-infinite solid assumption in the 1-D coordinate system. A simplified film spread model was developed as a function of the maximum film spread fraction, which can be derived from energy conservation principles. A vapor sharing algorithm was also developed for film spreading into the neighboring computational cells. The model results were able to capture the initial rise in solid surface temperature during the initial spread of the film. However, the overall steady state temperature was slightly overpredicted. The solid embedded temperature matched well with experimental results. Variation of temperature within the film and the ambient gas temperature of the cell containing the film with time, obtained from the model was also shown.

Publication Title

International Journal of Heat and Fluid Flow