Performance of high-rubber-content modified asphalt chip seal in wet-freezing environments
Document Type
Article
Publication Date
8-10-2025
Department
Department of Civil, Environmental, and Geospatial Engineering
Abstract
To achieve cleaner production of asphalt materials for paving, recycling waste tires has become a valuable option. The rubber from waste tires enhances pavement performance, making it an effective and sustainable solution. This study explores the feasibility of using high-rubber-content modified asphalt in hot asphalt chip seal applications under wet-freezing environments. Materials from a field construction project were used to prepare two types of chip seal samples in the lab: one using modified asphalt with 25 % crumb rubber content and the other using emulsified asphalt. The asphalt binder properties, aggregate chip retention, surface friction, and bonding strength of both chip seals were evaluated. Simulated freeze-thaw testing over 1–5 cycles was conducted to assess shear and tensile bond strength loss. Field pull-off test, smoothness, and distress evaluation were performed at the construction site. The results indicate that using high-rubber-content modified asphalt outperformed in both binder and chip seal performance tests, demonstrating improved viscosity, enhanced resistance to high and low temperatures, superior bonding strength, and reduced surface cracking. High-rubber-content modified asphalt chip seal is ideal for regions with wet and freeze-thaw conditions. The successful implementation of this study promotes cleaner production by enhancing waste tire recycling efficiency in road construction and supporting resource sustainability.
Publication Title
Journal of Cleaner Production
Recommended Citation
Yin, L.,
Jin, D.,
Wu, M.,
Liu, Z.,
&
You, Z.
(2025).
Performance of high-rubber-content modified asphalt chip seal in wet-freezing environments.
Journal of Cleaner Production,
519.
http://doi.org/10.1016/j.jclepro.2025.145993
Retrieved from: https://digitalcommons.mtu.edu/michigantech-p2/1771