Impact dynamics of compound droplets on low-temperature copper plates
Document Type
Article
Publication Date
3-1-2025
Department
Department of Manufacturing and Mechanical Engineering Technology
Abstract
Dimethyl silicone oil–water compound droplets were generated using the injection technique and freely dropped on low-temperature (Tw = -13 °C) copper plates. The effects of impact height and water volume fraction α on the impact dynamics of the compound droplets were investigated. The different morphologies of compound droplets impinging on an ambient temperature (Tw = 25 °C) and the low-temperature copper metal plates were analyzed. It was seen that relative to the ambient temperature plate, the droplet impacting the low-temperature copper plate did not display Corona splashing. Moreover, the lower temperature plate slowed down the speed of the droplet impact spreading and jetting processes. Under the condition of an identical impact height, three water volume fractions were tested, and the jet height was observed to decrease as α gradually increased. Additionally, the spreading diameters of both the internal and external droplets increase with the impact height for a specific value of α.
Publication Title
Chemical Engineering Science
Recommended Citation
Tian, J.,
Han, X.,
Mehendale, S.,
Wang, H.,
&
Zhang, Z.
(2025).
Impact dynamics of compound droplets on low-temperature copper plates.
Chemical Engineering Science,
306.
http://doi.org/10.1016/j.ces.2025.121250
Retrieved from: https://digitalcommons.mtu.edu/michigantech-p2/1354