Capacitance characterization of multipath interconnects for nanotechnology circuits

Document Type

Article

Publication Date

5-1-2006

Department

Department of Electrical and Computer Engineering

Abstract

A multipath interconnect carries a signal on an electrical circuit by using the concept of parallel processing, that is, by providing two or more paths between the driver and the load. These paths are stacked vertically and isolated from one another by insulating layers between them. In this paper, we have used the Green's function method to determine the parasitic capacitances associated with a system of nanoscale multipath interconnects fabricated on a silicon-based substrate.

Publisher's Statement

© 2006 Wiley Periodicals, Inc. Publisher’s version of record: https://doi.org/10.1002/mop.21495

Publication Title

Microwave and Optical Technology Letters

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