Capacitance characterization of multipath interconnects for nanotechnology circuits
Department of Electrical and Computer Engineering
A multipath interconnect carries a signal on an electrical circuit by using the concept of parallel processing, that is, by providing two or more paths between the driver and the load. These paths are stacked vertically and isolated from one another by insulating layers between them. In this paper, we have used the Green's function method to determine the parasitic capacitances associated with a system of nanoscale multipath interconnects fabricated on a silicon-based substrate.
Microwave and Optical Technology Letters
Capacitance characterization of multipath interconnects for nanotechnology circuits.
Microwave and Optical Technology Letters,
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© 2006 Wiley Periodicals, Inc. Publisher’s version of record: https://doi.org/10.1002/mop.21495