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Department of Electrical and Computer Engineering


The Journal of World Intellectual Property published by John Wiley & Sons Ltd This paper analyzes the findings of an international survey questionnaire to which responses were received from over 500 members from different technical societies of the Institute of Electrical and Electronics Engineers (IEEE). The survey is primarily intended to uncover members' perceptions of patent filing and research-driven innovation. Our thesis statement is twofold. First, the introduction of basic intellectual property (IP) courses to university Science, Technology, Engineering, and Mathematics curricula would teach students valuable basics of IP and associated issues, technology protection; and possibly stimulate novel/innovative R&D outcomes. Second, studying relevant active/lapsed/expired patent documents could provide stimulating input for ongoing academic research. After analyzing the survey results we conclude that IP coursework could be a catalyst for students and researchers to explore patent opportunities related to their specific interests. The resulting knowledge would further enable researchers to prepare more compelling funding applications. In our experience, IEEE conference publications are often closely aligned with inventions to solve pressing technical problems. Conference papers typically comprise of cutting-edge research/industry findings, with a short time between paper submission and presentation. Furthermore, conference organizers choose themes representing the forefront of technologies that often lead to inventions. These could fuel patent developments, but academic research environments often provide little if any incentives for academic researchers to prepare and file patent applications. Indeed, the attainment of high impact journal publications remains the primary metric by which research activity is judged and future academic tenure achieved.

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© 2020 The Authors. Publisher’s version of record:

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Journal of World Intellectual Property

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Creative Commons Attribution 4.0 International License
This work is licensed under a Creative Commons Attribution 4.0 International License.


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