Title

DIC-IR Analysis of Transient Thermal Stresses

Document Type

Conference Proceeding

Publication Date

3-5-2021

Department

Department of Mechanical Engineering-Engineering Mechanics

Abstract

This paper shows the feasibility of determining transient thermal strains and stresses using simultaneous time-dependent full-field temperature and displacement measurements along the surface of simple and complex structures. Temperature and displacements were experimentally determined by a set-up composed of a thermographic infrared (IR) micro-bolometer camera coupled to a stereo Digital Image Correlation (DIC) system. A polycarbonate flat disc-shaped specimen was tested under transient thermal inputs. The thermal expansion coefficient of polycarbonate was also measured using the same experimental set up. The mechanical or net strain distributions were determined from the total or gross DIC measured strains by subtracting the free induced temperature strains. The final strain distributions were compared with analytical and finite element solutions determined by using the IR test-measured temperature distributions.

Publication Title

Conference Proceedings of the Society for Experimental Mechanics Series

ISBN

9783030598631

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