Optical-electrical printed wiring board for high-speed computing applications
Document Type
Article
Publication Date
7-15-2013
Abstract
Optical-electrical printed wiring boards were fabricated featuring mechanical transfer (MT)-compatible interconnections for out-of-plane optical signal routing with an average optical link loss of 10.7 dB. Commercially available components were integrated into an optical layer for out-of-plane optical routing, including light turning devices that feature spherical micro lens arrays, a total internal reflection mirror, and alignment slots compatible with standard MT connectors. The feasibility of the optical-electrical printed wiring board is discussed in detail to demonstrate its compatibility with common printed circuit board manufacturing processes. The optical-electrical printed wiring board prototypes survived thermal cycling (-40°C to 85°C) and humidity exposure (95% humidity) showing an overall degradation of < 3 dB of optical performance. Operational failure (> 18 dB) occurred after environmental aging life testing at 110°C for 216 h. © 2013 Society of Photo-Optical Instrumentation Engineers (SPIE).
Publication Title
Optical Engineering
Recommended Citation
Dingeldein, J.,
Kruse, K.,
Demars, C.,
Middlebrook, C.,
Friedrich, C.,
&
Roggemann, M.
(2013).
Optical-electrical printed wiring board for high-speed computing applications.
Optical Engineering,
52(3).
http://doi.org/10.1117/1.OE.52.3.035201
Retrieved from: https://digitalcommons.mtu.edu/michigantech-p/12018