Laboratory shear bond test for chip-seal under varying environmental and material conditions, Lingyun You, Dongzhao Jin, Zhanping You, Qingli Dai, Xinfeng Xie, Sarah Washko, Samantha Cepeda
Michigan Tech Publications

Investigation of adhesion and interface bond strength for pavements underlying chip-seal: Effect of asphalt-aggregate combinations and freeze-thaw cycles on chip-seal, Lingyun You, Zhanping You, Qingli Dai, Xinfeng Xie, Sarah Washko, Junfeng Gao
Department of Civil, Environmental, and Geospatial Engineering Publications