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Abstract

A wood composite board or panel, such as particleboard, fiberboard, oriented strand board or waferboard and a method of producing the same. The composite board or panel comprises a plurality of wood pieces, thermoset resin to bind the wood pieces and a filler having a high thermal conductivity. Examples of such a filler include natural and synthetic graphites, metal, carbon, silicon carbide and other similar compounds and their mixtures.

Patent Number

6,702,969

Assignee

Board of Control of Michigan Technological University, Houghton, MI (US)

Application Number

10/352,481

Date Filed

1-28-2003

Certificate of Correction

No

Issue Date

3-9-2004

Disciplines

Engineering | Materials Science and Engineering | Polymer and Organic Materials

Method of making wood-based composite board

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