Date of Award
2017
Document Type
Open Access Master's Thesis
Degree Name
Master of Science in Computer Engineering (MS)
Administrative Home Department
Department of Electrical and Computer Engineering
Advisor 1
Joshua M. Pearce
Committee Member 1
Zhaohui Wang
Committee Member 2
Gowtham S.
Abstract
This thesis attempts to show how an open source 3-D printer platform, the self replicating rapid prototype (RepRap), could be used to accelerate the development of research and manufacturing tools. Two projects are shown as examples, both utilizing components of the 3-D printer platform.
The first project is to develop an instrument capable of performing automated large-area four-point probe measurements. A modified RepRap 3-D Printer with a four-point probe in place of the 3-D printer head is utilized as a precision positioning platform. The printer together with custom designed measurement circuit and software performs automated measurement on multiple points on the sample. Three-part experiments were performed to validate the system performance and it was found to be comparable to existing commercial equipment. The developed system is fully open sourced and cost 70% less than manual proprietary systems.
The second project tried to build large size fused filament fabrication (FFF) 3-D printers (2 x 1 x 0.6 meters) by retrofitting an existing CNC machine frame with FFF print head and single board computer running open source 3-D printer controller software. A variety of 3-D object was printed to showcase the printer capability to print simple and complex objects.
The result of both projects is comparable to existing commercial equipment and showed how researchers, engineers and makers could use existing open source 3-D printer platform to accelerate the development of research and manufacturing tools.
Recommended Citation
Chandra, Handy, "INVESTIGATION OF THE USE OF 3-D PRINTER PLATFORM AS BUILDING BLOCK FOR RAPID DESIGN OF RESEARCH AND MANUFACTURING TOOL", Open Access Master's Thesis, Michigan Technological University, 2017.
Included in
Electrical and Electronics Commons, Electro-Mechanical Systems Commons, Hardware Systems Commons